YASKAWA XU-ACP130-B01 Wafer Pre Alignment Device  

Product Manual：

YASKAWA XU-ACP130-B01 Wafer Pre Alignment Device
Introduction: YASKAWA XU-ACP130-B01 Semiconductor Equipment Wafer Positioning Calibration Component, completes wafer angle and center calibration.
High positioning accuracy ensures wafer transport consistency
Fast visual inspection, no delay in alignment response
Flexible clamping structure to avoid scratching the wafer surface
Dustproof and clean design, suitable for dust-free workshop environment
Built in anomaly detection, automatic wafer offset alarm
Servo drive is stable, with no impact or vibration during start and stop
Small integrated body, easy to install inside the machine

High temperature resistant material, not easily deformed during long-term operation
Standard communication interface, linked device main control system
Fault self checking function, quickly identify abnormal points
Support uninterrupted production operations throughout the day
Modular structure, easy disassembly and maintenance
Anti electromagnetic interference, peripheral RF equipment does not affect operation
Can be adapted to calibrate wafers of various sizes and specifications
Collaborative work of supporting Yaskawa handling manipulator
Conclusion: YASKAWA XU-ACP130-B01 has precise and stable positioning, and is a core alignment spare part for wafer transfer technology.

Product detailed pictures：

XU-ACP130-B01

product video

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