Yaskawa XU-ACP130-B11 wafer pre aligner  

Product Manual：

Yaskawa XU-ACP130-B11 wafer pre aligner
Yaskawa XU-ACP130-B11 is a semiconductor device specific wafer pre aligner that completes wafer position correction and angle positioning.
High precision visual inspection with minimal positioning and correction errors
Compatible with standard size wafers, with strong versatility
High speed calibration process, reducing the processing time of a single chip
Dust free sealed structure, suitable for clean workshop environment
Built in multiple limit protections to prevent wafer collision and damage
Servo driven transmission, running smoothly without shaking
The communication interface is complete and can be directly connected to the device controller
Equipped with self checking function, quick fault prompt

Wide temperature stable operation, supporting 7 × 24-hour continuous operation
Lightweight and compact body, saving internal space of the machine
Wear resistant adsorption structure, making it difficult to scratch when taking and placing wafers
Visual parameter adjustment, easy debugging operation
Anti vibration whole machine design, high durability under production line conditions
Original Yaskawa precision accessories, stable accuracy for long-term use
Can be paired with wafer transfer robotic arms for collaborative operation
Conclusion: Yaskawa XU-ACP130-B11 wafer pre aligner accurately completes the wafer alignment process, ensuring the normal processing of subsequent photolithography and coating processes.

Product detailed pictures：

XU-ACP130-B11

product video

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