TEL 3D81-050029-V1 Printed Circuit Board  

Product Manual：

TEL 3D81-050029-V1 Printed Circuit Board
TEL 3D81-050029-V1 is compatible with semiconductor etching and deposition equipment signal transmission
Multi layer precision wiring with low signal transmission loss
Channel electrical isolation to resist electromagnetic interference in the workshop
Flame retardant industrial substrate, resistant to high and low temperature clean workshop environment
Standard slot structure, easy and fast disassembly and replacement
Board surface solder mask protection, moisture-proof, anti-oxidation, and not easily aging
Partition regular layout, convenient for maintenance and troubleshooting
Reinforced sheet metal structure to withstand long-term vibration of equipment
Integrate multiple signal channels to synchronously collect sensor data

Improve circuit protection with overvoltage and overcurrent protection
High precision gold-plated solder pads, firmly soldered and not easily detached
Compact size, saving installation space inside the control cabinet
Support multi module communication linkage, strong system compatibility
Original precision craftsmanship, stable long-term operation with low malfunctions
Compatible with all TEL plasma semiconductor process equipment in the range
Summary: TEL 3D81-050029-V1 printed circuit board has stable signal, anti-interference and durability, and is the core circuit accessory for signal interaction in semiconductor equipment.

Product detailed pictures：

3D81-050029-V1

product video

Other links

Crucial CT102464BF160B memory module
 PM802F 3BDH0000002R1 Programmable Logic Controller
 SD812F 3BDH00014R1 power module

Other links

PFTL 101B 20.0KN 3BSE004203R1 sensor
S710D-EST2 transceiver
VT-HNC100-1-23/W-08-P-0 R900958999 Driver module