TEL 3M80-004459-Z2PCB board assembly

Product Manual：

TEL 3M80-004459-Z2 PCB board assembly is compatible with TEL semiconductor etching and cleaning equipment.
1. Multi layer compact wiring, suitable for narrow installation spaces on machines
2. Precise impedance control, low transmission loss of high-frequency signals
3. Large area copper grounding to reduce electromagnetic interference
4. Multiple sets of thermal conductive vias for balanced heat dissipation during full load operation
5. Sinking gold solder pads, repeatedly soldered to prevent oxidation and virtual soldering
6. Layered routing of strong and weak electricity to isolate power supply noise
7. Differentiate the length of the line to reduce signal crosstalk delay

8. High temperature resistant substrate, suitable for cold and hot cycling conditions
9. Reserve shielding space to enhance the anti-interference ability of the whole machine
10. Micro porous electroplating process, stable and durable interlayer conductivity
11. Clean solder mask coating, moisture-proof, dustproof and corrosion-resistant
12. Component reinforcement patch, capable of withstanding continuous vibration of equipment
13. Original factory standard circuit, fully matching the corresponding model
14. Anti static circuit to protect onboard precision chips
15. Standard installation holes for easy disassembly and replacement
TEL 3M80-004459-Z2 PCB board component stably transmits process signals to ensure stable production of the machine.

Product detailed pictures：

3M80-004459-Z2

product video

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