Hirata AR-Wn150CL-3-S-M900-2-EB18A-AW Robot Component
Product Manual：
Hirata AR-Wn150CL-3-S-M900-2-EB18A-AW Robot Component
1. Automatic handling of semiconductor 300mm wafers in vacuum environment
2. Accurate loading and unloading of wafer materials inside the wafer etching chamber
3. Stable transfer of wafers inside the dust-free chamber during coating process
4. Automated handling and transportation of silicon wafers inside ion implantation equipment
5. JEOL electron beam testing equipment precise clamping and transportation of samples
6. Semiconductor EFEM equipment internal wafer box wafer docking and handling
7. Cleanroom, high cleanliness, clean working conditions, dust-free grabbing and conveying
8. Material positioning and transfer in vacuum chamber of thin film deposition process
9. Automated wafer turnover and transportation operation in chip testing process
10. Old production line, same model mechanical arm malfunction, complete machine replacement and assembly
11. New machine production debugging motion trajectory and positioning accuracy calibration
12. Precision packaging process, high-precision wafer alignment and handling operation
13. Automated loading and unloading of large-sized photovoltaic silicon wafers in vacuum environment
14. Regular maintenance, disassembly, and replacement of aging transmission components for equipment
15. Microscopic detection instruments automatically transfer samples in vacuum chambers
Hirata AR-Wn150CL-3-S-M900-2-EB18A-AW robot module focuses on high-precision wafer handling in semiconductor vacuum cleaning scenarios, and is suitable for maintenance, replacement, and automated loading operations of various semiconductor process equipment
Product detailed pictures：
AR-Wn150CL-3-S-M900-2-EB18A-AW
product video
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