AMAT 0190-13851 Rotating Combined Sputtering Machine

Product Manual：

AMAT 0190-13851 Rotating Combined Sputtering Machine
1. Semiconductor wafer magnetron sputtering coating process equipment
2. Equipped with a rotating substrate table to ensure the uniformity of film formation
3. Multi target co sputtering structure, supporting multi-layer thin film preparation
4. High vacuum chamber design to meet the sputtering process environment
5. The chamber is resistant to plasma corrosion and suitable for long-term process operation
6. Accurate gas flow control, regulating process atmosphere
7. Adjustable rotation speed, suitable for wafers of different specifications
8. Equipped with RF/DC sputtering power supply, suitable for various target materials

9. Built in sensor, real-time collection of chamber pressure and temperature
10. Reliable sealing of the cavity, reducing particle pollution caused by air leakage
11. Modular structure for easy maintenance and upkeep of the cavity
12. Support sputtering film formation of various metal and dielectric materials
13. Process parameters can be stored to ensure batch consistency
14. Equipped with hardware interlocking to ensure the safe operation of equipment
15. Adapt to semiconductor metallization and passivation film deposition processes
AMAT 0190-13851 rotary joint sputtering machine is used for vacuum sputtering thin film preparation on semiconductor wafers.

Product detailed pictures：

0190-13851

product video

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