TEL 3B87-003543-11 Heater Assembly
Product Manual：
Brand: TEL (Tokyo Electronics)
Model: 3B87-003543-11
Type: Precision Heater Assembly
Application: Wafer heating/temperature compensation unit for TEL lithography/etching/deposition equipment
Power: several hundred watts (typical 200-800W)
Voltage: 200-240V AC (single-phase)
Temperature control: High precision (± 0.1 ℃), suitable for semiconductor processes
Material: Stainless steel/special alloy cavity, corrosion-resistant, temperature resistant
Interface: Dedicated power supply+temperature control signal connector, plug and play
Environment: Cleanroom Class 1, compatible with high vacuum
Main Features
Semiconductor grade precision temperature control ensures wafer process uniformity and yield
Integrated heating+sensing+temperature control, integrated module, reducing on-site debugging
Long life and anti-aging, suitable for 24-hour continuous production
Fast thermal response, fast temperature rise and fall speed, and increased equipment capacity
Vacuum/cleanroom specific, no particle release, compliant with SEMI standards
Original factory matching design, seamlessly compatible with TEL equipment
Fault self diagnosis with temperature/power anomaly monitoring
Compact structure, suitable for small spaces inside equipment
Leak proof sealing, suitable for process gas/chemical environments
Low power consumption and high efficiency, reducing operating costs
Standardized interfaces, easy replacement, and reduced downtime
Tolerant to harsh environments, resistant to vibration and electromagnetic interference
Long term supply support, semiconductor spare parts lifecycle guarantee
Full factory inspection, 100% power/temperature calibration
Compatible with multiple processes, universal in photolithography, etching, deposition and other processes
Product detailed pictures：
3B87-003543-11
product video
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