شينكو SBX08-000073-11 لوحة الدوائر المطبوعة

دليل المنتج：

The Shinko SBX08-000073-11 printed circuit board is an original matching circuit board for semiconductor equipment, with the following core features:
1. Multi layer stacked wiring structure, high-density wiring suitable for precision process equipment
2. Precise impedance control, low transmission loss of high-speed sensing signals
3. Large area grounding copper layer effectively suppresses electromagnetic interference in the workshop
4. Dense thermal conductive metal through holes ensure balanced heat dissipation during continuous operation of the equipment
5. The immersion gold process solder pad is not easily oxidized after multiple soldering, and the contact is stable
6. Layered isolation of power signals to reduce voltage clutter interference
7. Differential circuit with equal length design to reduce signal crosstalk distortion

8. High Tg industrial substrate, resistant to high and low temperature cycling conditions
9. Reserved shielding installation points, complete EMC protection for the whole machine
10. Laser micro hole conduction process ensures long-lasting and reliable interlayer connections
11. Dust free special solder mask coating, moisture-proof and particle proof
12. Reinforced patch welding process to resist equipment vibration during operation
13. Match with Shinko’s original equipment circuit standards, with strong compatibility
14. Built in anti-static circuit to protect onboard precision chips
15. Standardized external hole positions, easy disassembly and replacement operation
Shinko SBX08-000073-11 printed circuit board ensures long-term stable operation of semiconductor equipment signal transmission

صور مفصلة للمنتج：

SBX08-000073-11

فيديو المنتج

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