KYOSAN HV-PS8-FIL power PCB
Product Manual：
KYOSAN HV-PS8-FIL power PCB is compatible with semiconductor high-voltage power modules, with stable circuit and reliable voltage resistance.
1. High voltage layered wiring, sufficient insulation spacing, excellent voltage resistance performance
2. High heat-resistant substrate, not easily deformed during continuous high-temperature operation
3. Thickened copper foil for high current transmission and low temperature rise
4. Strong and weak current zoning wiring, with minimal signal interference
5. Thickened solder mask coating, moisture-proof, dustproof and corrosion-resistant
6. Reserve standard testing points for quick troubleshooting
7. Thickened electroplating on the hole wall, making it less prone to cracking during cold and hot cycles
8. Standard positioning holes for components, easy assembly and replacement
9. KYOSAN HV-PS8-FIL power PCB has strong anti-static ability and is suitable for dust-free workshops
10. Low thermal expansion material, stable size in a wide temperature environment
11. The pad has strong adhesion and is resistant to earthquakes, making it difficult to solder off
12. Anti ion migration process, high humidity without potential leakage hazards
13. Integrated filtering circuit to reduce the space occupied by external components
14. Low circuit loss, improving the overall efficiency of the power supply
15. KYOSAN HV-PS8-FIL power PCB layout is compact, saving internal space of the equipment
KYOSAN HV-PS8-FIL power PCB has strong stability under high voltage conditions and is the core circuit substrate for wafer equipment power supply.
Product detailed pictures：
HV-PS8-FIL
product video
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