TEL 3D81-000102-V1 interface module
Product Manual：
TEL 3D81-000102-V1 Interface Module (TYB61C-1/TOP1)
Suitable for Tokyo Electronic Etching CVD、 Coating and developing semiconductor equipment, whole machine signal relay connection board
TEL factory specific interface PCB, the same model can be directly replaced on the machine
Connect the main control, servo, sensor, and pneumatic control units to transmit mixed signals
Multiple digital and analog channels, collecting temperature and pressure, limit, and vacuum feedback signals
Built in photoelectric isolation, strong and weak electrical separation, isolating cabinet electromagnetic interference
Integrated hardware protection against overcurrent, overvoltage, and static electricity
Multiple sets of standard slot terminals, compatible with various sub control boards
Gold plated circuit board, resistant to trace corrosive gases in clean workshops
Full board moisture-proof solder mask coating to prevent condensation and short circuit faults
Reinforced patch welding, long-term vibration of the production line is not easy to detach and break wires
Onboard status indicator light, quick identification of communication and power failures
Support internal bus of the device, synchronize process instructions of each cavity
Reserved testing points for convenient on-site verification and troubleshooting
Integrated layout of long rack, suitable for installation position of equipment control cabinet
Industrial wide temperature element device, stable operation under alternating cold and hot working conditions
Adapt to 7 × 24-hour uninterrupted wafer production process
Summary: TEL 3D81-000102-V1 is a signal exchange transfer board for semiconductor equipment, responsible for data exchange between the main control and various execution units, with strong anti-interference and convenient maintenance and replacement.
Product detailed pictures：
3D81-000102-V1
product video
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