TEL CX81-050064-V1 Printed Circuit Board
Product Manual：
TEL CX81-050064-V1 printed circuit board is a dedicated signal transfer PCB for Tokyo Electronics wafer etching equipment
1. Multi layer precision wiring, separate power, analog, and digital circuits
2. Equipped with signal conditioning circuit, stable collection of pressure and flow sensing signals
3. Onboard isolation circuit to resist cavity RF and motor electromagnetic interference
4. Multiple sets of terminal pads, connected to gas valves, temperature, and limit detection components
5. Reserve dedicated testing points, and there is no need to disassemble the cavity for troubleshooting
6. The board surface is dust-free with a three proof coating, which can withstand the corrosion of volatile gases in the process
7. TEL CX81-050064-V1 printed circuit board compatible with factory backplane direct insertion assembly
8. Built in surge protection and reverse connection protection, making it difficult for power grid fluctuations to damage channels
9. Thickened metalized via, less prone to circuit failure due to cold and hot cycling
10. Reinforced pad technology ensures uninterrupted long-term vibration signals of the equipment
11. Clearly label the line definition with silk screen printing for easy on-site maintenance and troubleshooting
12. Short term caching for data collection, with no loss of sampling information during brief power outages
13. Adapt to the high temperature environment inside the device and operate continuously with controllable temperature rise
14. Standard board size, spare parts of the same model can be directly replaced
15. TEL CX81-050064-V1 printed circuit board integrates multiple signal interactions and is compatible with 300mm wafer process equipment
TEL CX81-050064-V1 printed circuit board has stable signal transmission and is a spare part for the bottom layer circuit of the semiconductor cavity core
Product detailed pictures：
CX81-050064-V1
product video
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