XTRAMUS B-00-23L4GMPA2 Printed Circuit Board
Product Manual：
XTRAMUS B-00-23L4GMPA2 Printed Circuit Board
Introduction: XTRAMUS B-00-23L4GMPA2 is suitable for semiconductor equipment main control circuit carrying, precise and durable
High TG industrial substrate, high temperature resistance, suitable for equipment constant temperature workshop environment
Precision HDI wiring process, uniform line spacing, low signal transmission loss
Thickened conductive copper foil, capable of carrying high currents, with minimal temperature rise during long-term operation
Multi layer laminated structure, layered isolation of strong and weak electricity, reducing signal interference
Full board electrical isolation design to resist electromagnetic and surge impacts in equipment workshops
The solder mask layer is dense and resistant to oxidation, effectively preventing solder joint short circuits and circuit corrosion
Standard positioning holes and solder pads, high adaptability for automated surface mounting and soldering
Accurate impedance control to meet the stable transmission requirements of high-speed communication signals
Multi specification metalized via, reliable and not easily broken multi-layer circuit conductivity
Clear silk screen markings on the board for easy assembly, maintenance, and troubleshooting
Anti warping process treatment, long-term high and low temperature cycling is not easy to deform
Zero halogen flame retardant material, in compliance with industrial equipment safety protection standards
Unified standard board edge size, directly replace spare parts of the same specification circuit board
Large area copper plating for heat dissipation, reducing the aging rate of onboard components
Original precision etching process, this XTRAMUS B-00-23L4GMPA2 is matched with the original machine circuit
Conclusion: XTRAMUS B-00-23L4GMPA2 is a stable circuit carrier spare part suitable for long-term continuous production of wafer equipment
Product detailed pictures：
B-00-23L4GMPA2
product video
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