Daihen TW39-000021-11 RF Automatic Matcher

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#Daihen TW39-000021-11 RF Automatic Matcher

1. Real time impedance automatic calibration of semiconductor dry etching chamber
2. Power adaptation and matching of PECVD thin film deposition RF circuit
3. PVD sputtering coating plasma load dynamic impedance compensation
4. Remote plasma cleaning equipment with stable RF impedance adaptation
5. Rapid adjustment of impedance for plasma dry peeling of crystal round photoresist
6. Third generation semiconductor process plasma RF power matching
7. Panel TFT etching process RF circuit voltage stabilization matching
8. Real time adaptation of RF load in photovoltaic thin film deposition chamber

9. Dynamic optimization of impedance for plasma activation treatment on wafer surface
10. Precision RF link matching control of ALD atomic layer deposition
11. Optical coating chamber cleaning plasma impedance matching operation
12. Plasma cleaning and RF impedance calibration before chip packaging
13. Automatic adaptation of laboratory vacuum plasma process load
14. Stable regulation of RF impedance for fluorine based gas dissociation plasma
15. This Daihen TW39-000021-11 RF automatic matching device tracks real-time changes in cavity plasma impedance, quickly completes 50 Согласование импеданса Ом, reduces RF reflection power, and protects upstream RF power supply
Общий, Daihen TW39-000021-11 has a fast response speed, excellent suppression of reflected waves, and is suitable for long-term uninterrupted plasma process stable operation in semiconductor technology.

Подробные фотографии продукта：

TW39-000021-11

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