MKS AX7685-200 Remote Plasma Source

Руководство по продукту：

#MKS AX7685-200 Remote Plasma Source

1. Dry cleaning of impurities deposited inside semiconductor CVD chamber
2. ALD equipment chamber fluorine based plasma cleaning operation
3. Removal treatment of adhesion on the surface of power chip etching cavity
4. Remote plasma removal of photoresist on storage chip production line
5. Silicon carbide chip process gas activation dissociation processing
6. Regular online cleaning of LCD panel TFT equipment chamber
7. Decomposition and removal of organic residual substances in perovskite photovoltaic cavities
8. Plasma surface activation modification treatment of quartz tooling parts
9. Purification and cleaning of sputtering residue inside PVD coating equipment chamber

10. Laboratory vacuum chamber surface pretreatment activation operation
11. Removal of carbon deposits and impurities in third-generation semiconductor epitaxial equipment
12. Purification of trace organic pollutants on the surface of the wafer during the packaging stage
13. Non contact dry peeling of excess film layer in optical coating machine
14. Purification and cleaning of dust accumulation on the inner wall of lithium electrode coating chamber
15. This MKS AX7685-200 remote plasma source can generate active free radicals at a distance, avoiding damage to the workpiece from high-energy ion impact

Общий, the MKS AX7685-20 has high activation efficiency and good protection for the cavity and substrate, making it suitable for regular cavity cleaning in semiconductor mass production.

Подробные фотографии продукта：

AX7685-20

видео о продукте

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