Удаленный источник плазмы MKS AX7700-10
Руководство по продукту：
#Удаленный источник плазмы MKS AX7700-10
1. Normalization of fluorine based gas online cleaning in PE-ALD atomic layer deposition chamber
2. Harmless removal of silicon-based CVD thin film deposition cavity wall silicide deposition layer
3. Advanced logic chip production line photoresist non-contact dry stripping operation
4. Silicon carbide power device process pipeline reaction gas activation dissociation
5. Periodic descaling and cleaning of display panel TFT film equipment chamber
6. Decomposition and removal of organic by-products inside the perovskite photovoltaic coating cavity
7. Plasma purification of trace organic impurities on the surface of the substrate before wafer packaging
8. Plasma activation modification treatment of quartz bearing tooling surface
9. Overall cleaning of metal residues inside the chamber of PVD sputtering coating equipment
10. Laboratory vacuum process chamber pretreatment plasma activation process
11. Removal and cleaning of carbon deposits on the inner wall of third-generation semiconductor epitaxial furnaces
12. Mild peeling of excess dielectric film in optical multilayer coating cavity
13. Environmentally friendly cleaning of solidified stains on the inner wall of lithium electrode coating chamber
14. Surface particle removal of chip testing vehicles after long-term use
15. This MKS AX7700-10 remote plasma source generates neutral reactive free radicals to prevent electrical damage to the wafer caused by high-energy ion bombardment
Общий, the MKS AX7700-10 has high gas dissociation efficiency, низкое пылеобразование, and low cavity loss, making it suitable for long-term stable cavity cleaning operations in high-end semiconductor production lines.
Подробные фотографии продукта：
AX7700-10
видео о продукте
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