Модуль рассеивания тепла NIHON SP200T10K80U14
Руководство по продукту：
Модуль рассеивания тепла NIHON SP200T10K80U14
Введение: NIHON industrial equipment integrated water-cooled heat dissipation module from Japan, suitable for semiconductor precision process equipment.
Model SP200 series, integrated water-cooled channel and heat dissipation fin integrated structure
Suitable for 10kW power devices, with a stable temperature control range of 80 ℃
High thermal conductivity aluminum alloy substrate, with high thermal conductivity efficiency and low thermal resistance
Sealed water-cooled circuit, leak proof and corrosion-resistant, suitable for dust-free workshops
Built in temperature sensing probe, real-time monitoring of heat dissipation substrate temperature
Standard inlet and outlet quick connect fittings are standard and easy to disassemble and replace
Surface anodic anti-corrosion treatment, long-term use is not easy to oxidize and scale
Adapt to high heating components such as RF power supply, servo, and main control board
Optimization design of flow channel, uniform water flow without local high temperature hotspots
Equipped with over temperature warning signal output and linked equipment protection shutdown
Small and compact structure, saving installation space inside the cabinet
Anti vibration fixed bracket, no loose or leaking pipelines during machine operation
Compatible with industrial circulating cooling water systems and universal water cooling conditions
Original factory matching of Japanese etching, coating, and testing semiconductor equipment
Supports continuous full load heat dissipation for 7 × 24 часы, with durability and low failure rate
Заключение: NIHON SP200T10K80U14 has stable temperature control and leakage prevention, and is a core heat dissipation replacement spare part for semiconductor equipment.
Подробные фотографии продукта：
SP200T10K80U14
видео о продукте
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