TEL 3M80-003141-14 PCB Assembly

Руководство по продукту：

TEL 3M80-003141-14 PCB Assembly
Tokyo Electronic Etching/Thin Film Machine Original Integrated Circuit Board Components
Multi layer layered wiring, isolated from RF interference, stable signal transmission
Integrated sensing, valve control, communication multi-channel signal processing circuit
Low release gas specific substrate, suitable for vacuum dust-free process chambers
Fully gold-plated solder pad slot, not prone to oxidation and virtual soldering during long-term operation
Equipped with basic overvoltage and overcurrent protection circuits, protecting onboard components
Thickened and reinforced substrate, resistant to continuous machine vibration and less prone to breakage
Onboard status indicator light, quickly locate signal fault points

Integrated board components, plug-in installation, easy maintenance and replacement
Fully covered moisture-proof solder mask layer, delaying the aging and loss of the circuit
Partition regular wiring, clear line identification, easy troubleshooting
Built in communication circuit, connected to the upper control system of the whole machine
Control the signals of cavity valves, sensors, and RF auxiliary components
Industrial wide temperature adaptation, поддержка 7 × 24-hour uninterrupted operation
Compatible with TEL series semiconductor thin film deposition and plasma etching equipment
Краткое содержание: TEL 3M80-003141-14 has strong resistance to radio frequency interference and clean adaptability, and is the core signal control PCB component of semiconductor process machines.

Подробные фотографии продукта：

3M80-003141-14

видео о продукте

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