YASKAWA XU-ACP4860 Машина для предварительного выравнивания пластин
Руководство по продукту：
YASKAWA XU-ACP4860 Машина для предварительного выравнивания пластин
Введение: YASKAWA XU-ACP4860 is a semiconductor specific pre alignment equipment suitable for 300mm wafers, with high positioning accuracy and fast operation speed, suitable for use in etching and thin film deposition production lines.
Specially designed for 300mm silicon wafers, matched with AMAT series process machines
High precision visual inspection, accurately identifying wafer notches and center positions
Direct drive servo rotating structure, with low vibration during operation and stable repeated positioning
Non contact detection to avoid scratching the wafer surface
Quickly complete positioning correction and shorten the processing cycle of a single chip
Stainless steel sealed body, meeting clean room dust-free production standards
Built in vacuum suction fixation, the wafer is not easily displaced or slipped during placement
Equipped with multiple fault alarms, automatic alerts for edge damage and missing pieces
Industrial isolation circuit to resist workshop RF and motor electromagnetic interference
Стандартный интерфейс связи, capable of connecting to the production line main control and MES system
Modular layout of the whole machine, simple and convenient disassembly, maintenance and repair
Широкий диапазон температур и стабильная работа, suitable for long-term operation in constant temperature and dust-free workshops
Built in power on self-test program, quickly troubleshooting optical path and driver faults
Compact and small in size, saving installation space inside the device cavity
Japanese original precision parts, continuous production, долговечность, низкий процент отказов
Заключение: YASKAWA XU-ACP4860 has precise positioning and meets cleanliness standards, making it the core supporting equipment for 300mm wafer transfer processes.
Подробные фотографии продукта：
XU-ACP4860
видео о продукте
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