Yaskawa XU-RC350S-J01 Wafer Robot
Product Manual：
Yaskawa XU-RC350S-J01 Wafer Robot
1. Accurate transfer between 300mm wafer FOUP box and machine cavity
2. Contactless grabbing and transfer of silicon wafers inside the vacuum lock chamber
3. The wafer is smoothly transferred from the feeding port of the etching equipment to the process chamber
4. Automatic loading and unloading of wafers to be tested inside JEOL testing equipment
5. Clean and dust-free environment, low vibration handling to prevent chip edge breakage and scratches
6. Continuous flow and transportation of sheets between workstations of thin film deposition equipment
7. Automated wafer loading and unloading of chip electrical testing machine ports
8. Old production line, same model mechanical arm, overall disassembly, replacement, debugging
9. Large stroke telescopic rotating positioning operation inside a vacuum sealed chamber
10. Equipment online debugging motion trajectory and repeated positioning accuracy calibration
11. Vacuum suction cup flexible adsorption suitable for thin and large-sized wafer transfer
12. EFEM internal caching station for orderly storage and retrieval of wafers
13. Stable and cyclic operation in all day mass production mode to ensure process rhythm
14. Regular maintenance and replacement of easily worn parts such as transmission shafts and suction cups
15. Internal conveying operation of vacuum process for third-generation semiconductor power chips
Yaskawa XU-RC350S-J01 wafer manipulator is adapted for high-precision wafer transfer in high-end semiconductor dust-free vacuum scenarios, used for automated loading and unloading of production lines and replacement and operation of faulty spare parts
Product detailed pictures：
XU-RC350S-J01
product video
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