هاتف 2L08-05105-11 لوحة دارات مطبوعة

دليل المنتج：

TEL 2L08-05105-11 PCB board compatible with TEL semiconductor etching equipment
1. High density wiring saves installation space
2. Accurate impedance and low signal transmission loss
3. Large area grounding, مكافحة التدخل الكهرومغناطيسي
4. Heat dissipation through holes, no high temperature during long-term operation
5. Sinking gold solder pads, not easily oxidized and prone to virtual soldering
6. Separate the wiring of strong and weak electricity, without interfering with each other
7. Differential long lines with low signal delay

8. لوح مقاوم لدرجات الحرارة العالية, suitable for hot and cold environments
9. Reserve shielding space to prevent static electricity
10. Micro porous process, stable interlayer conductivity
11. Clean solder mask, مقاوم للرطوبة والغبار
12. Component reinforcement, مقاومة لاهتزاز المعدات
13. Original factory wiring, matching corresponding models
14. Comes with signal acquisition circuit
15. Standard hole position, easy to replace and disassemble
TEL 2L08-05105-11 PCB board transmission equipment control signal to ensure stable production of the machine

صور مفصلة للمنتج：

2L08-05105-11

فيديو المنتج

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