TEL 3R80-000276-11 Printed Circuit Board
Product Manual：
TEL 3R80-000276-11 printed circuit board compatible with TEL semiconductor process equipment.
1. Multi layer compact wiring, saving internal installation space of equipment
2. Precise impedance control, low transmission loss of high-frequency signals
3. Large area copper grounding to reduce electromagnetic interference impact
4. Multiple sets of thermal conductive vias for uniform heat dissipation during long-term operation
5. Sinking gold solder pads, multiple soldering is not easy to oxidize and virtual solder
6. Layered routing of strong and weak electricity to isolate voltage clutter
7. Differentiate the length of the line to reduce signal crosstalk delay
8. High temperature resistant substrate, suitable for alternating cold and hot working conditions
9. Reserve shielding points to enhance the anti-interference ability of the entire machine
10. Micro porous electroplating process, stable and durable interlayer conductivity
11. Clean solder mask coating, moisture-proof, dustproof and corrosion-resistant
12. Component reinforcement welding to withstand equipment vibration during operation
13. Original factory circuit design, matched with corresponding TEL models
14. Anti static circuit design, protection board for precision chips
15. Standard installation holes, easy to replace and disassemble, saving time and effort
TEL 3R80-000276-11 printed circuit board stably transmits equipment control signals to ensure the normal operation of machine lines.
Product detailed pictures：
3R80-000276-11
product video
Other links
HEIDENHAIN PLD 16-8 Input/Output Module
Gespac GESOUT-3 Input/Output Module
GALIL DMC-1832 Bus Motion Control Card
Other links
TEWS TPMC815-11 Interface module
UNITROL 1020 UNS0119A-Z,V1 3BHE030579R0003 Excitation module
VE3007 KJ2005X1-BA1 12P4375X012 Control module
