TEL 3R80-000276-11 Printed Circuit Board
Руководство по продукту：
TEL 3R80-000276-11 printed circuit board compatible with TEL semiconductor process equipment.
1. Multi layer compact wiring, saving internal installation space of equipment
2. Precise impedance control, low transmission loss of high-frequency signals
3. Large area copper grounding to reduce electromagnetic interference impact
4. Multiple sets of thermal conductive vias for uniform heat dissipation during long-term operation
5. Sinking gold solder pads, multiple soldering is not easy to oxidize and virtual solder
6. Layered routing of strong and weak electricity to isolate voltage clutter
7. Differentiate the length of the line to reduce signal crosstalk delay
8. Устойчивая к высоким температурам подложка, suitable for alternating cold and hot working conditions
9. Reserve shielding points to enhance the anti-interference ability of the entire machine
10. Micro porous electroplating process, stable and durable interlayer conductivity
11. Clean solder mask coating, влагостойкий, пыленепроницаемый и устойчивый к коррозии
12. Component reinforcement welding to withstand equipment vibration during operation
13. Original factory circuit design, matched with corresponding TEL models
14. Anti static circuit design, protection board for precision chips
15. Standard installation holes, легко заменить и разобрать, saving time and effort
TEL 3R80-000276-11 printed circuit board stably transmits equipment control signals to ensure the normal operation of machine lines.
Подробные фотографии продукта：
3R80-000276-11
видео о продукте
Другие ссылки
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