MKS FI20620-1 Remote Plasma Source
Руководство по продукту：
#MKS FI20620-1 Remote Plasma Source
1. Online cleaning of silicon deposits inside the CVD process chamber
2. Cleaning operation of fluorine gas dissociation chamber in ALD equipment
3. Contactless dry stripping treatment of photoresist for storage chips
4. Activation and decomposition of reaction gases in the process of silicon carbide devices
5. Regular cleaning and maintenance of the TFT coating chamber on the panel
6. Decomposition and removal of organic by-products in perovskite photovoltaic cavities
7. Plasma purification of trace impurities on the surface of wafers before processing
8. Surface activation and modification treatment of quartz process accessories
9. Cleaning of metal residue stains inside PVD sputtering chamber
10. Pre treatment of plasma activation in laboratory vacuum chamber
11. Removal of carbon deposits on the inner wall of third-generation semiconductor epitaxial furnaces
12. Mild peeling of excess dielectric film in optical coating cavity
13. Cleaning of solidified impurities on the inner wall of lithium film deposition chamber
14. Removal of Fine Particle Contaminants on the Surface of Chip Testing Vehicles
15. This MKS FI20620-1 remote plasma source produces active free radicals from a distance, avoiding damage to the wafer caused by high-energy ion impact
Общий, MKS FI20620-1 has high gas cracking efficiency, low cavity loss, stable and durable operation, and is suitable for the normalized cavity cleaning process of semiconductor production lines.
Подробные фотографии продукта：
FI20620-1
видео о продукте
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