ADVANCED ENERGY 3151801-004 Remote Plasma Source
Product Manual：
ADVANCED ENERGY 3151801-004 Remote Plasma Source Product Features
ADVANCED ENERGY 3151801-004 is a 6KW remote plasma cleaning source suitable for semiconductor etching and deposition equipment, used for chamber cleaning and exhaust gas treatment. It has strong process adaptability and the following characteristics:
Integrated power module, eliminating the need for separate power supply installation
Built in solid-state active matching network, with a wide range of impedance adaptation
High purity anodized aluminum cavity, corrosion-resistant and not easy to remove impurities
High gas dissociation efficiency, significantly reducing the consumption of cleaning consumables
Specialized pulse ignition structure, capable of stable ignition even in low-temperature chillers
Circulating water-cooled heat dissipation structure, stable temperature control during long-term operation
Compatible with various process gases such as NF3, oxygen, argon, etc
Multiple current and voltage protection, automatic shutdown protection under abnormal working conditions
Standard industrial communication interface, capable of interfacing with equipment master control linkage
Built in real-time monitoring circuit, synchronized feedback of power and pressure data
Compact rack mounted structure, occupying minimal space for cabinet installation
Plasma long-distance transportation to avoid wafer damage from sputtering
Continuous load operation at all times, compatible with 24-hour mass production lines
Equipped with a built-in fault diagnosis program, quickly locate ignition and water circuit faults
Original factory standardized size, same model spare parts can be directly replaced and used immediately
ADVANCED ENERGY 3151801-004 remote plasma source dissociation is stable and easy to maintain, making it the core supporting equipment for semiconductor thin film equipment cavity cleaning.
Product detailed pictures：
3151801-004
product video
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