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Home Others LAM YSC-BSA01038PL Lift Assembly
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TEL TPFB300-1 5880-000051-V1 Printed Circuit Board
TEL TPFB300-1 5880-000051-V1 Printed Circuit Board

LAM YSC-BSA01038PL Lift Assembly

Model:YSC-BSA01038PL
Product status: New/Used
Warranty period: 365 days
Structural form: Other (specific form may vary depending on application)
Please contact Linda for a quote, thank you!

Category: Others Tags: YSC-BSA01038PL, YSC-BSA01038PL Numerical Technical Manual
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  • Description
Description

LAM YSC-BSA01038PL Lift Assembly

Product Manual:

LAM YSC-BSA01038PL Lift Assembly
Introduction: LAM original wafer lifting assembly, used for vertical transfer of wafers in etching machines
Screw precision transmission, high accuracy in lifting and positioning
Dust free sealed structure, suitable for clean process environment
Multiple sets of limit sensors, anti impact protection for wafers
Servo drive, smooth start stop without shaking
Adjustable lifting speed, suitable for different process rhythms
Equipped with vacuum adsorption, the wafer can be picked up and placed without scratching
Complete signal feedback, interface with equipment master control

Multiple safety protections for overload and timeout
Lightweight and compact structure, saving machine space
Wear resistant guiding components, stable long-term operation
Anti particle design reduces chamber pollution
Integrated assembly, easy to disassemble and maintain
Wide temperature stability, supporting 7 × 24-hour continuous operation
Original LAM etching equipment with good compatibility
Fault self check prompt, quickly troubleshoot abnormalities
Conclusion: LAM YSC-BSA01038PL elevator assembly accurately completes wafer lifting and transportation, ensuring stable operation of semiconductor processes

Product detailed pictures:

YSC-BSA01038PL

product video

https://www.module-dcs.com/wp-content/uploads/2026/06/YSC-BSA01038PL.mp4

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